Resonance device and filter including the same

ABSTRACT

A resonance device including a plurality of signal input/output ports, further including: a plurality of resonators arranged in a state of being spaced apart from each other; and a notch resonator formed at a side of the plurality of resonators, wherein the notch resonator includes: a laminated part having a laminated structure formed by layering a plurality of conductive layers; a first transmitting layer connected to one of the plurality of conductive layers; and a bridge connected between the first transmitting layer and one of the plurality of resonators, wherein one of the plurality of signal input/output ports is connected to the bridge.

CROSS REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit of Korean Patent Application No.10-2014-0053932, filed on May 7, 2014, entitled RESONANCE DEVICE ANDFILTER INCLUDING THE SAME, which is hereby incorporated by reference inits entirety into this application.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The exemplary embodiments according to the concept of the presentinvention relate, in general, to a resonance device and, moreparticularly, to a resonance device having a laminated structure andincluding a notch resonator connected to one of a plurality ofresonators via a bridge, and to a filter including the resonance device.

2. Description of the Related Art

Generally, communication systems use a variety of filters. Incommunication systems, the filters are devices which screen for andallow to pass only specified frequency band signals, and are classifiedinto low pass filters (LPF), band pass filters (BPF), high pass filters(HPF), band stop filters (BSF), etc. according to frequency bandsfiltered thereby.

Further, according to methods of manufacturing filters or devices usedin filters, the filters may be classified into LC filters, transmissionline filters, cavity filters, dielectric resonator (DR) filters, ceramicfilters, coaxial filters, waveguide filters, SAW (Surface Acoustic Wave)filters, etc.

To simultaneously realize narrow-band characteristics and excellentintercepting characteristics of a filter, it is required to use aresonator having a high Q-factor. In this case, the resonator typicallytakes the form of a PCB (Printed Circuit Board) type, a dielectric typeor a monoblock type resonator.

DOCUMENTS OF RELATED ART

Patent Document 1 Korean Patent Application Publication No.10-2010-0048862.

SUMMARY OF THE INVENTION

Accordingly, the present invention has been made keeping in mind theabove problems occurring in the related art, and the present inventionis intended to propose a resonance device and a filter including theresonance device, in which the resonance device has a laminatedstructure and includes a notch resonator connected to one of a pluralityof resonators via a bridge; thereby realizing excellent narrow-bandcharacteristics and excellent intercepting characteristics of thefilter.

In an embodiment of the present invention, there is provided a resonancedevice including a plurality of signal input/output ports, furtherincluding: a plurality of resonators arranged in a state of being spacedapart from each other; and a notch resonator formed at a side of theplurality of resonators, wherein the notch resonator includes: alaminated part having a laminated structure formed by layering aplurality of conductive layers; a first transmitting layer connected toone of the plurality of conductive layers; and a bridge connectedbetween the first transmitting layer and one of the plurality ofresonators, wherein one of the plurality of signal input/output portsmay be connected to the bridge.

In an embodiment, the resonance device may further include: a caseprovided with a first ground surface and a second ground surface, thefirst and second ground surfaces facing each other, the case envelopingthe plurality of resonators and the notch resonator therein.

In an embodiment, the plurality of conductive layers may include: afirst conductive layer grounded to the first ground surface; a secondconductive layer grounded to the first ground surface and placed in astate of being spaced apart from the first conductive layer; and a thirdconductive layer placed between the first conductive layer and thesecond conductive layer in a state of being spaced apart from the firstconductive layer and the second conductive layer, without being groundedto the first ground surface, wherein the first transmitting layer may beconnected to the third conductive layer.

In an embodiment, the plurality of conductive layers may include: afirst conductive layer connected to the first ground surface; and asecond conductive layer placed in a state of being spaced apart from thefirst conductive layer, without being grounded to the first groundsurface, wherein the first transmitting layer may be connected to thesecond conductive layer.

In an embodiment, the resonance device may further include: a secondtransmitting layer connected to another one of the plurality ofconductive layers, wherein the plurality of conductive layers mayinclude: a first conductive layer connected to the first ground surface;a second conductive layer grounded to the first ground surface andplaced in a state of being spaced apart from the first conductive layer;a third conductive layer placed between the first conductive layer andthe second conductive layer in a state of being spaced apart from thefirst conductive layer and the second conductive layer, without beinggrounded to the first ground surface; and a fourth conductive layerplaced between the second conductive layer and the third conductivelayer in a state of being spaced apart from the second conductive layerand the third conductive layer, without being grounded to the firstground surface, wherein the laminated part may further include a viaelectrically connecting the third conductive layer and the fourthconductive layer to each other.

In an embodiment, the first transmitting layer may be connected to thethird conductive layer, and the second transmitting layer may beconnected to the fourth conductive layer.

In an embodiment, the plurality of conductive layers may include: afirst conductive layer connected to the first ground surface; a secondconductive layer grounded to the first ground surface and placed in astate of being spaced apart from the first conductive layer; a thirdconductive layer placed between the first conductive layer and thesecond conductive layer in a state of being spaced apart from the firstconductive layer and the second conductive layer, without being groundedto the first ground surface; a fourth conductive layer placed in a stateof being spaced apart from the first conductive layer and opposite tothe third conductive layer based on the first conductive layer, withoutbeing grounded to the first ground surface; and a fifth conductive layerplaced in a state of being spaced apart from the second conductive layerand opposite to the third conductive layer based on the secondconductive layer, without being grounded to the first ground surface,wherein the laminated part may further include a via electricallyconnecting the third conductive layer, the fourth conductive layer andthe fifth conductive layer to each other. In an embodiment, the firsttransmitting layer may be connected to the third conductive layer.

In an embodiment, the space inside the case may be charged with ceramic.

In an embodiment of the present invention, there is provided a band passfilter including the resonance device.

The resonance device of an embodiment of the present invention isadvantageous in that it has a laminated structure and includes a notchresonator connected to one of a plurality of resonators via a bridge,thereby realizing excellent narrow-band characteristics and excellentintercepting characteristics.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features and advantages of the presentinvention will be more clearly understood from the following detaileddescription when taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a plan view of a resonance device to which the operationalperformance of a resonance device according to an embodiment of thepresent invention is compared;

FIG. 2 is a front view of an embodiment of the resonance device shown inFIG. 1;

FIG. 3 is an equivalent circuit diagram of an embodiment of theresonance device shown in FIG. 1;

FIG. 4 is a plan view of a resonance device according to an embodimentof the present invention;

FIG. 5 is a front view of an embodiment of the resonance device shown inFIG. 4;

FIG. 6 is an equivalent circuit diagram of an embodiment of theresonance device shown in FIG. 4;

FIG. 7 is a graph showing the frequency response characteristics of theresonance device shown in FIG. 1 and the frequency responsecharacteristics of the resonance device shown in FIG. 4 so as to comparethe frequency response characteristics to each other;

FIG. 8 is a side view of an embodiment of a notch resonator shown inFIG. 4;

FIG. 9 is a perspective view of the notch resonator shown in FIG. 8;

FIG. 10 is a side view of another embodiment of the notch resonatorshown in FIG. 4;

FIG. 11 is a perspective view of the notch resonator shown in FIG. 10;

FIG. 12 is a side view of a further embodiment of the notch resonatorshown in FIG. 4;

FIG. 13 is a perspective view of the notch resonator shown in FIG. 12;

FIG. 14 is a side view of still another embodiment of the notchresonator shown in FIG. 4;

FIG. 15 is a perspective view of the notch resonator shown in FIG. 14;and

FIG. 16 is a plan view of a resonance device according to anotherembodiment of the present invention.

DESCRIPTION OF SYMBOLS

-   -   100, 200A, 200B: resonance device    -   120-1˜120-5, 220-1˜220-4: resonator    -   250: Notch resonator    -   130-1˜130-5, 230-1˜230-4, 255: laminated part    -   140-1-1˜140-5, 240-1˜240-4, 270: transmitting layer    -   280: bridge

DETAILED DESCRIPTION OF THE INVENTION

In the following description, the structural or functional descriptionspecified to exemplary embodiments according to the concept of thepresent invention is intended to describe the exemplary embodiments, soit should be understood that the present invention may be variouslyembodied, without being limited to the exemplary embodiments.

The exemplary embodiments according to the concept of the presentinvention may be variously modified and may have various shapes, soexamples of which are illustrated in the accompanying drawings and willbe described in detail with reference to the accompanying drawings.However, it should be understood that the exemplary embodimentsaccording to the concept of the present invention are not limited to theembodiments which will be described hereinbelow with reference to theaccompanying drawings, but various modifications, equivalents, additionsand substitutions are possible, without departing from the scope andspirit of the invention.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, these elements should notbe limited by these terms. These terms are only used to distinguish oneelement, from another element. For instance, a first element discussedbelow could be termed a second element without departing from theteachings of the present invention. Similarly, the second element couldalso be termed the first element.

It will be understood that when an element is referred to as being“coupled” or “connected” to another element, it can be directly coupledor connected to the other element or intervening elements may be presenttherebetween.

In contrast, it should be understood that when an element is referred toas being “directly coupled” or “directly connected” to another element,there are no intervening elements present. Further, the terms usedherein to describe a relationship between elements, for example,“between”, “directly between”, “adjacent” or “directly adjacent” shouldbe interpreted in the same manner as those described above.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein, thesingular forms “a,” “an” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise.

It will be further understood that the terms “comprise”, “include”,“have”, etc. when used in this specification, specify the presence ofstated features, integers, steps, operations, elements, components,and/or combinations of them but do not preclude the presence or additionof one or more other features, integers, steps, operations, elements,components, and/or combinations thereof.

Unless otherwise defined, all terms including technical and scientificterms used herein have the same meaning as commonly understood by one ofordinary skill in the art to which this invention belongs.

It will be further understood that terms, such as those defined incommonly used dictionaries, should be interpreted as having a meaningthat is consistent with their meaning in the context of the relevant artand the present disclosure, and will not be interpreted in an idealizedor overly formal sense unless expressly so defined herein.

FIG. 1 is a plan view of a resonance device to which the operationalperformance of a resonance device according to an embodiment of thepresent invention is compared. FIG. 2 is a front view of an embodimentof the resonance device shown in FIG. 1.

As shown in FIGS. 1 and 2, the resonance device 100 may include a case110, a plurality of resonators 120-1 to 120-5 provided in the case 110,and a plurality of ports PORT1 and PORT2.

Although the case 110 shown in FIG. 1 has a rectangular shape, it shouldbe understood that the shape of the case 110 is not limited to therectangular shape.

The case 110 may include a first ground surface 112 and a second groundsurface 114 which face each other. In an embodiment, all the surfaces ofthe case 110, which include the first ground surface 112 and the secondground surface 114, may be made of a conductive material. In anotherembodiment, all or a part of the surfaces of the case 110, with theexception of the first ground surface 112 and the second ground surface114, may be made of a conductive material.

The case 110 made of a conductive material may protect the plurality ofresonators 120-1 to 120-5 provided therein from external environment. Inother words, the case 110 may intercept electromagnetic waves producedby other devices placed around the case 110 or by the flow of anelectric current in a circuit, thereby preventing the externalenvironment from affecting the operation of the resonators 120-1 to120-5 provided in the case 110.

In an embodiment, the interior of the resonance device 100 which is aspace 115 of the case 110 may be charged with a dielectric material, forexample, ceramic.

The plurality of resonators 120-1 to 120-5 may include respectivelaminated parts 130-1 to 130-5 and respective transmitting layers 140-1to 140-5.

Here, the laminated parts 130-1 to 130-5 may include respectiveconductive layers 130-1A to 130-5A and respective conductive layers130-1B to 130-5B, in which the conductive layers 130-1A to 130-5A andassociated conductive layers 130-1B to 130-5B are spaced apart from eachother and form respective laminated structures.

The layer structure (for example, the number and arrangement of layers)of each of the resonators 120-1 to 120-5 including the respectivelaminated parts 130-1 to 130-5 and the respective transmitting layers140-1 to 140-5 may be practically equal to the layer structure of anotch resonator which will be described later herein, so the layerstructure of the resonators 120-1 to 120-5 will be described in detaillater herein together with the structure of the notch resonator withreference to FIGS. 8 to 15.

The first port PORT1 may be connected to the transmitting layer 140-1 ofthe first resonator 120-1, and the second port PORT2 may be connected tothe transmitting layer 140-5 of the fifth resonator 120-5.

Each of the first port PORT1 and the second port PORT2 may be a signalinput port or a signal output port through which a signal is input to oroutput from the resonance device 100.

FIG. 3 is an equivalent circuit diagram of an embodiment of theresonance device shown in FIG. 1.

As shown in FIGS. 1 to 3, the laminated parts 130-1 to 130-5 and thetransmitting layers 140-1 to 140-5 of the resonance device 100 of FIG. 1may have capacitance components and inductance components, and may beequivalent to an LC resonant circuit of FIG. 3 based on the capacitancecomponents and the inductance components. Furthermore, the resonancedevice 100 of FIG. 1 may function as a band pass filter (BPF).

The inductance component of the first resonator 120-1 may be equivalentto a first inductor L1, and the capacitance component of the firstresonator 120-1 may be equivalent to a first capacitor C1.

Further, the inductance component between the first port PORT1 and thefirst resonator 120-1 may be equivalent to a sixth inductor LP1, and theinductance component between the first resonator 120-1 and the secondresonator 120-2 may be equivalent to a seventh inductor L12.

In the same manner, the resonance device 100 of FIG. 1 may be equivalentto the LC resonant circuit of FIG. 3 which includes a plurality ofinductors L1 to L5, LP1, L12, L23, L34, L45 and L5P and a plurality ofcapacitors C1 to C5.

Further, the magnitudes of the capacitance components of the resonators120-1 to 120-5 may be controlled by controlling at least one of thenumber, shape and area of the conductive layers forming the respectivelaminated parts 130-1 to 130-5, and the spaced distance between aplurality of laminated conductive layers.

Further, the magnitudes of the inductance components of the resonators120-1 to 120-5 may be controlled by controlling at least one the lengthand area of the respective transmitting layers 140-1 to 140-5.

In other words, the magnitudes of the capacitance components and themagnitudes of the inductance components of the resonance device 100 maybe controlled by controlling the above-mentioned factors. When theresonance device 100 functions as a band pass filter, the passband ofthe band pass filter may be controlled by controlling the magnitudes ofthe capacitance components and the magnitudes of the inductancecomponents.

FIG. 4 is a plan view of a resonance device according to an embodimentof the present invention. FIG. 5 is a front view of an embodiment of theresonance device shown in FIG. 4.

As shown in FIGS. 1, 4 and 5, the resonance device 200A according to anembodiment of the present invention may include a notch resonator 250instead of the fifth resonator 120-5 of the resonance device 100 of FIG.1.

In this case, the arrangement of the second port PORT2′ may be changedfrom that of the second port PORT2 of the resonance device 100 shown inFIG. 1.

Here, the structure of the first port PORT1′ and the plurality ofresonators 220-1 to 220-4 of the resonance device 200A shown in FIG. 4may practically remain the same as the structure of the first port PORT1and the plurality of resonators 120-1 to 120-4 of the resonance device100 shown in FIG. 1.

That is, the conductive layers 230-1A to 230-4A, 230-1B to 230-4B (seeFIG. 5) and the transmitting layers 240-1 to 240-4 (see FIG. 5) of theresonance device 200A are practically equal to the conductive layers130-1A to 130-4A, 130-1B to 130-4B (see FIG. 2) and the transmittinglayers 140-1 to 140-4 (see FIG. 2) of the resonance device 100, andfurther explanation thereof will be omitted in the followingdescription.

In an embodiment, all the surfaces of a case 210, which include a firstground surface 212 and a second ground surface 214, may be made of aconductive material. In another embodiment, all or a part of thesurfaces of the case 210 with the exception of the first ground surface212 and the second ground surface 214 may be made of a conductivematerial.

In an embodiment, the interior of the resonance device 200A which is thespace 215 of the case 210 may be charged with a dielectric material, forexample, ceramic.

The notch resonator 250 may include a laminated part 255, a transmittinglayer 270 and a bridge 280.

In an embodiment, the layer structure (for example, the number andarrangement of the layers) of the notch resonator 250 may be equal tothe layer structure of the resonators 220-1 to 220-4.

However, in this case, the width and length of the layers (for example,260, 262, 270) and the spaced distance of the layers (for example, 260,262, 270) may be different from that of the resonators 220-1 to 220-4.

The bridge 280 may be connected between the transmitting layer 270 ofthe notch resonator 250 and the transmitting layer 240-4 of the fourthresonator 220-4. The second port PORT2′ may be connected to the bridge280.

The structure of the notch resonator 250 will be described in detaillater herein with reference to FIGS. 8 to 15.

FIG. 6 is an equivalent circuit diagram of an embodiment of theresonance device shown in FIG. 4.

Referring to FIGS. 4 to 6, the laminated parts 230-1 to 230-4 and 260,the transmitting layers 240-1 to 240-4 and 270, and the bridge 280 ofthe resonance device 200A of FIG. 4 may have capacitance components andinductance components, and may be equivalent to an LC resonant circuitof FIG. 6 based on the capacitance components and inductance components.Further, the resonance device 200A of FIG. 6 may function as a band passfilter (BPF).

In the same manner, the inductors L1 to L4, LP1, L12, L23, L34 of FIG. 6and the capacitors C1 to C4 of FIG. 6, which are the elements of theequivalent circuit of the resonators 220-1 to 220-4 of FIG. 4, may beequivalent to the inductors L1 to L4, LP1, L12, L23, L34 of FIG. 3 andthe capacitors C1 to C4 of FIG. 3 which are the elements of theequivalent circuit of the resonators 120-1 to 120-4 of FIG. 1.

The inductance component of the notch resonator 250 may be equivalent toa notch inductor LN, and the capacitance component of the notchresonator 250 may be equivalent to a notch capacitor CN.

The inductance component between the fourth resonator 220-4 and thesecond port PORT2′ may be equivalent to a ninth inductor L4P, and theinductance component between the second port PORT2′ and the notchresonator 250 may be equivalent to a tenth inductor LPN.

The magnitude of the capacitance component of the notch resonator 250may be controlled by controlling at least one of the number, shape andarea of the conductive layers constituting the laminated part 255 of thenotch resonator 250, and the spaced distance between the plurality oflaminated conductive layers.

Further, the inductance component of the notch resonator 250 may becontrolled by controlling at least one of the length and area of thetransmitting layer 270 of the notch resonator 250.

In other words, the magnitude of the capacitance component and themagnitude of the inductance component of the notch resonator 250 may becontrolled by controlling the above-mentioned factors. When theresonance device 200A functions as a band pass filter, the range offrequencies on which filter effects will be conferred in the passband ofthe band pass filter may be controlled by controlling the magnitude ofthe capacitance component and the magnitude of the inductance component,as will be described later herein with reference to FIG. 7.

FIG. 7 is a graph showing the frequency response characteristics of theresonance device shown in FIG. 1 and the frequency responsecharacteristics of the resonance device shown in FIG. 4 so as to comparethe frequency response characteristics to each other.

As shown in FIGS. 1, 4, 6 and 7, when it is assumed that, in the firstcase CASE1, the band pass characteristics of the resonance device 100 ofFIG. 1 within a first frequency band f1 are shown by the dotted line,the band pass characteristics of the resonance device 200A of FIG. 4 maybe expressed by the solid line.

That is, in the first case CASE1, notch filter effects can be conferredon the first frequency band f1 by controlling the factors of the notchresonator 250, which are, for example, the number, shape and area of theconductive layers of the laminated part 255 of the notch resonator 250,the spaced distance between the plurality of laminated conductivelayers, and the length and area of the transmitting layer 270 of thelaminated part 255.

Further, when it is assumed that, in the second case CASE2, the bandpass characteristics of the resonance device 100 of FIG. 1 within asecond frequency band f2 are shown by the dotted line, the band passcharacteristics of the resonance device 200A of FIG. 4 may be expressedby the solid line.

That is, in the second case CASE2, notch filter effects can be conferredon the second frequency band f2 by controlling the factors of the notchresonator 250, which are, for example, the number, shape and area of theconductive layers of the laminated part 255 of the notch resonator 250,the spaced distance between the plurality of laminated conductivelayers, and the length and area of the transmitting layer 270 of thelaminated part 255.

FIG. 8 is a side view of an embodiment of the notch resonator shown inFIG. 4. FIG. 9 is a perspective view of the notch resonator shown inFIG. 8.

As shown in FIGS. 4, 8 and 9, a notch resonator 250A that is anembodiment of the notch resonator 250 of FIG. 4 may include a laminatedpart 255A and a transmitting layer 270A.

For ease of description, the notch resonator 250A of FIGS. 8 and 9 isillustrated with the bridge 280 being omitted.

The laminated part 255A may include: a first conductive layer 260Agrounded to the first ground surface 212, a second conductive layer 262Athat is grounded to the first ground surface 212 and is spaced apartfrom the first conductive layer 260A, and a third conductive layer 264Athat is placed between the first conductive layer 260A and the secondconductive layer 262A without being grounded to the first ground surface212.

Here, the transmitting layer 270A may be connected to the thirdconductive layer 264A and may be grounded to the second ground surface214.

In an embodiment, the resonators 220-1 to 220-4 of FIG. 4 may have thesame layer structure (for example, the number and arrangement of layers)as that of the notch resonator 250A. In this case, the space 115 (seeFIG. 5) inside the case 210 (see FIG. 4) may be charged with adielectric material having a permittivity of 15 to 45. The resonancedevice 200A of FIG. 4 may function as a band pass filter (for example, anarrow band pass filter) having central frequencies of 800 MHz˜2.6 GHz.

FIG. 10 is a side view of another embodiment of the notch resonatorshown in FIG. 4. FIG. 11 is a perspective view of the notch resonatorshown in FIG. 10.

As shown in FIGS. 4, 10 and 11, a notch resonator 250B that is anotherembodiment of the notch resonator 250 of FIG. 4 may include a laminatedpart 255B and a transmitting layer 270B.

For ease of description, the notch resonator 250B of FIGS. 10 and 11 isillustrated with the bridge 280 being omitted.

The laminated part 255B may include: a first conductive layer 260Bgrounded to the first ground surface 212, and a second conductive layer264B placed in a state of being spaced apart from the first conductivelayer 260B without being grounded to the first ground surface 212.

The transmitting layer 270B may be connected to the second conductivelayer 264B, and may be grounded to the second ground surface 214.

In an embodiment, the resonators 220-1 to 220-4 of FIG. 4 may have thesame layer structure (for example, the number and arrangement of layers)as that of the notch resonator 250B. In this case, the space 115 (seeFIG. 5) inside the case 210 (see FIG. 4) may be charged with adielectric material having a permittivity of 15 to 45. The resonancedevice 200A of FIG. 4 may function as a band pass filter (for example, anarrow band pass filter) having central frequencies of 800 MHz˜2.6 GHz.

FIG. 12 is a side view of a further embodiment of the notch resonatorshown in FIG. 4. FIG. 13 is a perspective view of the notch resonatorshown in FIG. 12.

As shown in FIGS. 4, 12 and 13, a notch resonator 250C that is a furtherembodiment of the notch resonator 250 of FIG. 4 may include a laminatedpart 255C and transmitting layers 270-1C and 270-2C.

For ease of description, the notch resonator 250C of FIGS. 12 and 13 isillustrated with the bridge 280 being omitted.

The laminated part 255C may include: a first conductive layer 260C, asecond conductive layer 262C, a third conductive layer 264-1C, a fourthconductive layer 264-2C, and a via V1.

The first conductive layer 260C and the second conductive layer 262C maybe connected to the first ground surface 212, and may be placed in astate of being spaced apart from each other.

The third conductive layer 264-1C and the fourth conductive layer 264-2Cmay be placed between the first conductive layer 260C and the secondconductive layer 262C in a state of being spaced apart from the firstconductive layer 260C and the second conductive layer 262C,respectively, without being grounded to the first ground surface 212.

The fourth conductive layer 264-2C may be placed between the thirdconductive layer 264-1C and the second conductive layer 262C.

The third conductive layer 264-1C and the fourth conductive layer 264-2Cmay be placed in a state of being spaced apart from each other.

The third conductive layer 264-1C and the fourth conductive layer 264-2Cmay be electrically connected to each other by the via V1.

The first transmitting layer 270-1C may be connected to the thirdconductive layer 264-1C, and may be grounded to the second groundsurface 214, and the second transmitting layer 270-2C may be connectedto the fourth conductive layer 264-2C and may be grounded to the secondground surface 214.

In an embodiment, the resonators 220-1 to 220-4 of FIG. 4 may have thesame layer structure (for example, the number and arrangement of layers)as that of the notch resonator 250C. In this case, the space 115 (seeFIG. 5) inside the case 210 (see FIG. 4) may be charged with adielectric material having a permittivity of 15 to 45. The resonancedevice 200A of FIG. 4 may function as a band pass filter (for example, anarrow band pass filter) having central frequencies of 800 MHz˜2.6 GHz.

In an embodiment, the notch resonator 250C may further include anothervia (not shown) in addition to the via V1.

FIG. 14 is a side view of still another embodiment of the notchresonator shown in FIG. 4. FIG. 15 is a perspective view of the notchresonator shown in FIG. 14.

As shown in FIGS. 4, 14 and 15, a notch resonator 250D that is a stillanother embodiment of the notch resonator 250 of FIG. 4 may include alaminated part 255D and a transmitting layer 270D.

For ease of description, the notch resonator 250D of FIGS. 14 and 15 isillustrated with the bridge 280 being omitted.

The laminated part 255D may include a first conductive layer 260D, asecond conductive layer 262D, a third conductive layer 264-1D, a fourthconductive layer 264-2D, a fifth conductive layer 264-3D and a via V2.

The first conductive layer 260D and the second conductive layer 262D maybe connected to the first ground surface 212, and may be placed in astate of being spaced apart from each other.

The third conductive layer 264-1D may be placed between the firstconductive layer 260D and the second conductive layer 262D in a state ofbeing spaced apart from the first conductive layer 260D and the secondconductive layer 262D, without being grounded to the first groundsurface 212.

The fourth conductive layer 264-2D may be placed in a state of beingspaced apart from the first conductive layer 260D and opposite to thethird conductive layer 264-1D based on the first conductive layer 260D,without being grounded to the first ground surface 212.

The fifth conductive layer 264-3D may be placed in a state of beingspaced apart from the second conductive layer 262D and opposite to thethird conductive layer 264-1D based on the second conductive layer 262D,without being grounded to the first ground surface 212.

The via V2 may electrically connect the third conductive layer 264-1D,the fourth conductive layer 264-2D and the fifth conductive layer 264-3Dto each other.

The transmitting layer 270D may be connected to the third conductivelayer 264-1D and may be grounded to the second ground surface 214.

In an embodiment, the resonators 220-1 to 220-4 of FIG. 4 may have thesame layer structure (for example, the number and arrangement of layers)as that of the notch resonator 250D. In this case, the space 115 (seeFIG. 5) inside the case 210 (see FIG. 4) may be charged with adielectric material having a permittivity of 15 to 45. The resonancedevice 200A of FIG. 4 may function as a band pass filter (for example, anarrow band pass filter) having central frequencies of 800 MHz˜2.6 GHz.

In an embodiment, the notch resonator 250C may further include anothervia (not shown) in addition to the via V2.

FIG. 16 is a plan view of a resonance device according to anotherembodiment of the present invention.

As shown in FIGS. 4 and 16, the resonance device 200B according to theembodiment of the present invention includes a notch resonator 250′.Here, the notch resonator 250′ may be connected to the first resonator220-1 by a bridge 280′.

In this embodiment, the first port PORT1″ may be connected to the bridge280′.

Here, the structure of the resonance device 200B of FIG. 16 practicallyremains the same as the structure of the resonance device 200A of FIG.4, excepting that the notch resonator 250′ is connected to the firstresonator 220-1.

Although preferred embodiments of the present invention have beendescribed for illustrative purposes, those skilled in the art willappreciate that various modifications, additions and substitutions arepossible, without departing from the scope and spirit of the inventionas disclosed in the accompanying claims.

1. A resonance device comprising a plurality of signal input/outputports, further comprising: a plurality of resonators arranged in a stateof being spaced apart from each other; and a notch resonator formed at aside of the plurality of resonators, wherein the notch resonatorincludes: a laminated part having a laminated structure formed bylayering a plurality of conductive layers; a first transmitting layerconnected to one of the plurality of conductive layers; and a bridgeconnected between the first transmitting layer and one of the pluralityof resonators, wherein one of the plurality of signal input/output portsis connected to the bridge.
 2. The resonance device of claim 1, furthercomprising: a case provided with a first ground surface and a secondground surface, the first and second ground surfaces facing each other,the case enveloping the plurality of resonators and the notch resonatortherein.
 3. The resonance device of claim 2, wherein the plurality ofconductive layers comprise: a first conductive layer grounded to thefirst ground surface; a second conductive layer grounded to the firstground surface and placed in a state of being spaced apart from thefirst conductive layer; and a third conductive layer placed between thefirst conductive layer and the second conductive layer in a state ofbeing spaced apart from the first conductive layer and the secondconductive layer, without being grounded to the first ground surface,wherein the first transmitting layer is connected to the thirdconductive layer.
 4. The resonance device of claim 2, wherein theplurality of conductive layers comprise: a first conductive layerconnected to the first ground surface; and a second conductive layerplaced in a state of being spaced apart from the first conductive layer,without being grounded to the first ground surface, wherein the firsttransmitting layer is connected to the second conductive layer.
 5. Theresonance device of claim 2, further comprising: a second transmittinglayer connected to another one of the plurality of conductive layers,wherein the plurality of conductive layers comprise: a first conductivelayer connected to the first ground surface; a second conductive layergrounded to the first ground surface and placed in a state of beingspaced apart from the first conductive layer; a third conductive layerplaced between the first conductive layer and the second conductivelayer in a state of being spaced apart from the first conductive layerand the second conductive layer, without being grounded to the firstground surface; and a fourth conductive layer placed between the secondconductive layer and the third conductive layer in a state of beingspaced apart from the second conductive layer and the third conductivelayer, without being grounded to the first ground surface, wherein thelaminated part further includes a via electrically connecting the thirdconductive layer and the fourth conductive layer to each other.
 6. Theresonance device of claim 5, wherein the first transmitting layer isconnected to the third conductive layer, and the second transmittinglayer is connected to the fourth conductive layer.
 7. The resonancedevice of claim 2, wherein the plurality of conductive layers comprise:a first conductive layer connected to the first ground surface; a secondconductive layer grounded to the first ground surface and placed in astate of being spaced apart from the first conductive layer; a thirdconductive layer placed between the first conductive layer and thesecond conductive layer in a state of being spaced apart from the firstconductive layer and the second conductive layer, without being groundedto the first ground surface; a fourth conductive layer placed in a stateof being spaced apart from the first conductive layer and opposite tothe third conductive layer based on the first conductive layer, withoutbeing grounded to the first ground surface; and a fifth conductive layerplaced in a state of being spaced apart from the second conductive layerand opposite to the third conductive layer based on the secondconductive layer, without being grounded to the first ground surface,wherein the laminated part further includes a via electricallyconnecting the third conductive layer, the fourth conductive layer andthe fifth conductive layer to each other.
 8. The resonance device ofclaim 7, wherein the first transmitting layer is connected to the thirdconductive layer.
 9. The resonance device of claim 2, wherein a spaceinside the case is charged with ceramic.
 10. A band pass filterincluding the resonance device of claim 1.